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PROTOTYPE PCB SPEC
Material
Industry
standard quality
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FR4
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1.6mm
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35µm CU
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HAL (lead-free)
Layout requirements
Any format and any outline are possible,
without any extra charge!
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Pad/Via Restring > 0.4mm
(pad size minus drill diameter), at least tracksize/gapsize
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Soldermask > 0.15mm
(size on solder-layer minus pad size on cs/ss)
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Multilayer Antipads > 1.0mm
(pad size on negative innerlayer minus drill)
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Minimum holesize: Drill-end diameter = 0.3mm (12mil)
Track/Gap
Singlesided pcbs:
Doublesided and 6/4-layer multilayer pcbs:
Area
The minimum size of a single PCB=1 dm².
PCBs with a smaller area will be charged at this rate.
Where smaller PCBs are required, you can make your own
panel to achieve the minimum area 1 dm². This mini panel
can only have one outline. We can step up your mini
panel and route single pieces.
All prices include photoplotting (not
delivered with boards) and all tooling costs!
Position Print
Position print is white and will be
printed on the component side (TOP) only, or on both
sides (TOP and BOTTOM).
So as not to cover pads the position print will be
clipped by 0.2mm away from the soldermask. If you wish
to order silkscreen, please note, that a correct
adhesion in accordance to the IPC is only guaranteed, if
you choose the option soldermask.
Attention: Unless otherwise stated layers where
an eagle file is in question layers 21 and 25 will be
used to generate the position print.
E-Test
In electrical testing, all tracks are
checked for breaks and shorting.
MEDIUM VOLUME PCB SPECIFICATION
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Formats accepted: |
Drilling Formats |
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All Gerber formats |
Any ASCII format |
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HPGL |
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DXF |
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DPF |
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Emma |
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EDIF 4.0.0 |
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Material Types FR4 G30 G2000 PTFE |
High Specification |
Standard Specification |
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Max. Circuit Size (Con.PTH) |
550x550 |
550x550 |
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Max. Circuit Size (M/L) |
550x550 |
457x355 |
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Max. Board Thickness |
4.0 |
4.0 |
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Min. Board Thickness (Conv.PTH) |
0.2 |
0.5 |
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Max. Layer Count |
36 |
14 |
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Min. Board Thickness (M/L) |
4L 0.3 |
0.6 |
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(Min. Multilayer. thickness on request) |
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Min. Track Width |
0.1 |
0.15 |
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Min. Gap Width |
0.15 |
0.15 |
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Impedence Control |
+8% |
+10% |
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Drilling |
High Specification |
Standard Specification |
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Min. Finished Hole Size |
0.2 |
0.3 |
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Max. Aspect Ratio |
10.0:1 |
8.0:1 |
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Min. Annular Ring |
0.127 |
0.127 |
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Resist Mask |
High Specification |
Standard Specification |
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Liquid Photoimageable |
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Min. solder dam |
0.127 |
0.127 |
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Notation |
High Specification |
Standard Specification |
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Standard White/Yellow (Min. line width) |
0.127 |
0.127 |
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Other colours on request |
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Photoimageable available |
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Surface |
High Specification |
Standard Specification |
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H.A.S.L. |
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Electroless Nickel Immersion Gold |
0.050 - 02 µm Gold |
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Over 2 - 3 µm Nickel |
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Silver |
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Immersion Tin |
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Electrolytic Hard Gold over Nickel |
1 -5 µm Gold |
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Over 3 - 5 µm Nickel |
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Pure Gold (Wirebonding) |
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Carbon Ink |
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Peelable Solder Resist |
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Bare Board Testing |
High Specification |
Standard Specification |
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Mania Cube |
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Programmable test voltage 10 - 40v |
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Flying Probe Testing |
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Min. pad size |
0.05 |
0.1 |
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Min. pitch |
0.1 |
0.2 |
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Testing to Gerber data |
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Single Board Testing |
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Impedence Testing |
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Using Time Domain Reflectrometry
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Technologies |
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Impedance Control |
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Blind/Buried Vias |
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Hole Plugging |
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High Aspect Ratio Plating |
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HDI |
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Sequential Build up Technology |
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